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      MapleSim: Technological Superiority in Multi-Domain Physical Modeling &
      Simulation
 
      Engineers constantly demand innovation in modeling and simulation. This is driven by
      the need to simulate, for example, ever more sophisticated vehicle systems while
      minimizing development time and cost. The computer models necessary to generate
      these designs consume project time at an increasing rate, due largely to the limitations
      of existing simulation tools and the need to switch between tools to address multiple
      physical domains. While many existing simulation tools are based on a design
      metaphor that works well for control system design, engineers do not find them
      intuitive for physical modeling. Additionally, these tools often produce simulations that
      are too slow to model complex systems and, in some cases, lack the mathematical
      power to solve the governing equations.
      These are some of the issues that have driven the development of MapleSim, a new
      multi-domain simulation tool from Maplesoft. This article will explore the historical
      development of the early tools for simulation, and then expand on their design
      deficiencies. This is followed by a discussion of MapleSim, its unique design
      characteristics, and how it bypasses the limitations of current modeling and simulation
        technology.

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       > Quanser
        The Future of Engineering
 
                       Simply replace the word "countries" with "colleges"
in Obama's quotation and you have a presidential
dilemma that any engineering dean  can appreciate.
Deans can gauge how well their college is teaching by
whether their engineering graduates are innovating
and competing internationally.
  
 But teaching today's engineering students requires
innovation itself, because they learnt differently.
Change is needed to teach them better but budget
are tight and tightening.
                                                                      Read More..
      
 
       > Comsol
       Reduced Stresses Inside Semiconductor Chips Lead to Higher Reliability
       Semiconductors Manufacturers, thanks to technological advances that are leading to a
       continuous scaling of lithographic dimensions, are creating integrated circuit (ICs)
       that are increasingly smaller.
      
       Reducing silicon consumption without decreasing device reliability can mean multiple
       millions of dollars in cost savings. Thus, Pad Over Active (POA) structures have been
       implemented in most advanced semiconductor technologies in order to optimize
       area consumption. With it, active circuitry is designed test/bonding pads to exploit the
       interconnection properties of multilayer metal stacks. Simulation with
       COMSOL Multiphysics allows STMicroelectronics to study these effects and 
       formulate design rules that lead to robust circuits.
 
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